Abstract
The Ir(111)/SiC(111) interfaces were investigated by first-principles study based on density functional theory (DFT). Considering different stacking sites and terminations, six different interfaces were studied. The results show that an Ir(111) slab with 9 atom layers exhibits bulk-like interior characteristic, while a 12-atom-layer SiC(111) slab represents the properties of bulk SiC. Adhesion and interfacial energy results show that the C-terminated top-site (C-TS) and Si-terminated center-site (Si-CS) interfaces are highly stable with the highest work of adhesion of 6.35 and 6.23 J/
Science Press


High temperature materials have a wide range of applications in the aerospace, energy and national defense industries. At present, the commonly applied high temperature materials in aerospace mainly include refractory metals, super alloys and C/C composite materials. These materials have their own advantages, but the common disadvantage of these materials is that they are unable to maintain the performance for a long time in high-temperature oxidized environments. Anti-oxidation coating is probably the most effectively protective measure. Metal iridium (Ir) exhibits the unique physical and mechanical properties, such as high melting temperature (2430 ℃), excellent chemical compatibility, oxidation resistance, low oxygen and carbon permeability, which makes it a promising anti-oxidation coating candidat
Silicon carbide (SiC) is often used as reinforcement for various materials to improve the microstructure and properties of base material due to its distinct properties and good compatibility with other material
First-principle calculations are widely employed to study the interfaces of atomic or even electronic scale for revealing the adhesion strength, stability and mechanism of interface bondin
This research is structured as follows: (1) introduction of the calculation method and related parameters; (2) calculation of the properties of bulk Ir and SiC and the comparison between the calculated results and the reported results in the literature to certify the accuracy of the used calculation method. The appropriate number of atomic layers in Ir(111) and SiC(111) slabs was determined, and the properties of the Ir/SiC interface were investigated, such as work of adhesion, interfacial stability, electronic structure and bonding characteristics.
First-principle study was accomplished in the Cambridge Serial Total Energy Package (CASTEP) based on density functional theor
Kohn-Sham equation was solved with a self-consistent field (SCF) procedure to obtain the ground stat
Both metal iridium and β-SiC belong to the typically face centered cubic (fcc) crystal structure with space group of Fm-3m and F-43m, respectively. To evaluate the reliability of the methodology, the parameters of bulk Ir and β-SiC were calculated before the model construction, and our calculated lattice constant (a), bulk modulus (B), elastic constant (Cij) were compared with the published data, as listed in
Note: LDA: local density approximation; GGA-PW91: generalized gradient approximation Perdew-Wang 91
As shown in
Both Ir(111) and SiC(111) planes have considerable stabilit

Fig.1 Surface structures of Ir(111) and SiC(111) plans: (a) 10-atom-layer Ir(111) slab;(b) C-terminated 12-atom-layer SiC(111) slab; (c) Si-terminated 12-atom-layer SiC(111) slab
faces. SiC(111) plane is a typical polar surface with C-termina-tion or Si-termination, as shown in Fig.
To reduce the calculation time and ensure the accuracy, an appropriate number of atom layers for Ir(111) and SiC(111) slabs should be determined. The thickness of the slab can be confirmed by evaluating the variation of interlayer distances with increasing the number of atomic layers in slabs after relaxation. The variation of interlayer distance can be described as follow
(1) |
where and di/j are the atomic spacing between the adjacent i and j interlayers before and after relaxation, respectively; ∆i/j is the percentage of increase or decrease of interlayer distance after relaxation.
The alteration of interlayer spacing of SiC(111) and Ir(111) slabs changes as a function of termination and number of atom layers, as listed in
Note: positive and negative values of ∆i/j indicate the expansion and contraction of the interlayer spacing, respectively; for material SiC(111), ∆1/2 indicates the Si termination, and ∆5/6, ∆7/8, ∆9/10, ∆11/12, and ∆13/14 indicate the C termination for slabs with different thicknesses
Surface energy (γs) is defined as the energy required to form a new unit area of surface when the crystal is separated into two free surfaces along a specific plane and normally employed to describe the surface stability. The surface energy (γs) can be obtained by
(2) |
where Eslab represents the total energy of the slab, N is the total number of the primitive cells in the slab, Ebulk denotes the total energy of the primitive cells, As represents the surface area, and the factor 2 means that there are two surfaces.
The surface energies of Ir(111) and SiC(111) slabs with increasing the atomic layer are shown in
Since the atom types at the two ends of SiC slab are different, the calculated surface energy according to
Ir atoms can be located at three different positions of SiC(111) surface: top-site, center-site and hollow-site, as shown in

Fig.2 Schematic diagram of Ir/SiC interface (blue spheres are Ir atoms, grey spheres are C atoms and yellow spheres are Si atoms)

Fig.3 Cross (a~c) and top (d~f) views of three stacking sites of the C-terminated Ir(111)/SiC(111) interfaces: (a,d) top-site, (b,e) center-site, and (c,f) hollow-site
According to the test results, Ir(111)/SiC(111) interfaces are constructed by stacking 10-atom-layer Ir(111) on 12-atom-layer SiC(111). The orientation relationships are Ir(111)//SiC(111) and Ir[11]//SiC[11]. The lattice constant of (1×1)Ir(111) and (1×1)SiC(111) slabs is 0.282 427 2 and 0.310 186 5 nm, respectively. The Ir(111)/SiC(111) interface is a coherent interface with a lattice misfit of 4.68%. A vacuum layer of 1.5 nm was added to prevent the interaction between the upper and lower free surface, as shown in
Interface bonding strength can be evaluated by the work of adhesion (Wad), which is mainly originated from the electronic interaction of atoms at the interface. A large Wad suggests a high bonding strength. Wad can be expressed as follow
(3) |
where represents the total energy of the isolated 10-atom-layer Ir(111) slab, indicates the total energy of the isolated 12-atom-layer SiC(111) slab, is the total energy of the Ir/SiC system, and A is the interfacial area.

Wad can be calculated by unrelaxed geometries and relaxed geometries. By the former one, the total energy of unrelaxed models with different distances d0 (0.08~0.34 nm) is calculated, and then the relationship of Wad and interface distance d0 is obtained, as shown in Fig.4. The work of adhesive of six interface structures increase first and then decrease with the increase of interface distance. The maximum Wad corresponds to the optimal interfacial distance d0, which is 0.24 nm for Si-TS, 0.18 nm for Si-CS, C-CS and C-HS, and 0.20 nm for Si-HS and C-TS. In another case, the optimal interfacial separation is used to build the interfacial model, and then the total energy of these six structures at equilibrium state is obtained after full relaxation. The optimal d0 and Wad values for relaxed geometries are shown in
It can be seen from
Interfacial energy (γint) is another important factor to quantitatively analyze the interface stability. Interfacial energy is difficult to measure experimentally because it is essentially derived from the interfacial atomic chemical bonds and strain when different materials are combined, which can be described by
(4) |
where EIr/SiC is the total energy of the Ir/SiC interface at equilibrium distance; and are the total energy of primitive Ir and SiC cells, respectively; N and M represent the number of Ir atoms and SiC compounds in the interface, respectively; γIr and γSiC are the calculated surface energies of the Ir and SiC slabs, respectively; A is the area of the interface.
Generally, a stable interface structure has a small interfacial energy. The calculated interfacial energies of the six models are shown in
The interface strength and stability of the Ir/SiC are related to the interfacial electronic structure. Thus, the charge density differences of the Ir(111)/SiC(111) interfaces were analyzed. The C-TS and Si-CS interfaces are the most stable structures with the highest Wad and lowest γint, so the electronic structure analyses focus on these two structures. The charge density differences of the C-TS and Si-CS structures are presented in

Fig.5 Charge density differences for relaxed Si-TS (a) and C-TS (b) interfaces (the dotted line indicates the interface)

To further study the bonding characteristics of the C-TS and Si-CS interfaces, the partial density of states (PDOS) of the C-TS and Si-TS interfaces were investigated and presented in Fig.6, in which the dotted line denotes the Fermi level. The total density of states (TDOS) curves of C-TS and Si-TS interfaces are similar throughout the energy range, indicating that these two interfaces have similar electronic structures. Meanwhile, the two distinct peaks are observed near the Fermi level, indicating that both the interfaces have metallic features. The density of states (DOS) values of the C-TS and Si-CS interfaces near the Fermi level are 16.33 and 17.77 electron/eV, respectively. The larger value of 17.77 electron/eV means that the Si-CS interface has stronger metallic behavior than C-TS structure does.
For the C-TS interface (Fig.6a), the TDOS shows a low energy state appearing between -17 and -11 eV, which is mainly contributed by C-s and Si-sp orbits, while the TDOS peaks in the range from -10 eV to 0 eV are attributed to the Ir-d, C-p and Si-p orbits. For interfacial atoms, the Ir-d and C-p overlapping states can be observed between -7.5 and -2.5 eV, and a new state appears for both the Ir-d and C-p orbits at 1 eV. These results indicate that the adhesion and stability of C-TS interface is mainly due to the interaction of Ir-d and C-p orbits. For the Si-CS interface (Fig.6b), the low energy state is mainly due to C-s and Si-sp, which is similar to the situation of C-TS interface. The TDOS peaks in the range from -10 eV to 0 eV are mainly attributed to the Ir-d, C-p and Si-p orbits. Compared with the C-TS interface, sub-interfacial atoms of the SiC side contribute much more than interface atoms does. The interfacial Ir-d orbit has more overlapping states with sub-interface C-p. The Ir-C bonds form, therefore, the interface adhesion and stability mainly result from the interaction of Ir-d, Si-p and C-p orbits.
1) A 10-atom-layer Ir(111) slab is sufficient to represent the properties of the bulk Ir, while a SiC(111) slab with 12 layers possesses the bulk-like interior.
2) Electron structure analysis shows that the charge of interfacial Ir atoms transfers to the SiC side in C-terminated top-site (C-TS) interface, showing the ionic characteristics. While the charge from Ir, Si and C accumulates at the interface region and exhibits covalent bond characteristics in Si-terminated center-site (Si-CS) interface. Compared with the Si-CS interface, the charge accumulation at the interface of the C-TS structure is more obvious.
3) The partial density of states shows that the total density of states mainly results from the Ir-d, C-p and Si-p orbits; the C-TS interface mainly consists of Ir-C bonds, while the Ir-Si and Ir-C bonds form in the Si-CS interface. Compared with the C-TS interface, sub-interfacial atoms have more interactions with Ir atoms in Si-CS interface.
References
Halvorson J J, Wimber R T. Journal of Applied Physics[J], 1972, 43(6): 2519 [Baidu Scholar]
Mumtaz K, Echigoya J, Enoki H et al. Journal of Materials Science[J], 1995, 30: 465 [Baidu Scholar]
Vargas G J R, Goto T. Materials Transactions[J], 2003, 44(9): 1717 [Baidu Scholar]
Maury F, Senocq F. Surface and Coatings Technology[J], 2003, 163-164: 208 [Baidu Scholar]
Wang Liangbing, Chen Zhaofeng, Zhang Ying et al. International Journal of Refractory Metals and Hard Materials[J], 2009, 27(3): 590 [Baidu Scholar]
Wu Wangping, Lin Xin, Chen Zhaofeng et al. Plasma Chemistry and Plasma Processing[J], 2011, 31(3): 465 [Baidu Scholar]
Zhu Li’an, Bai Shuxin, Zhang Hong. Surface and Coatings Technology[J], 2011, 206(6): 1351 [Baidu Scholar]
Zhu Li’an, Bai Shuxin, Zhang Hong et al. Applied Surface Science[J], 2013, 265: 537 [Baidu Scholar]
Fortini A, Tuffias R. 35th Joint Propulsion Conference and Exhibit[C]. Los Angeles: American Institute of Aeronautics & Astronautics, 1999: 2894 [Baidu Scholar]
Hamilton J C, Yang N Y C, Clift W M et al. Metallurgical Transactions A[J], 1992, 23(3): 851 [Baidu Scholar]
Bai Shuxin, Zhu Li’an, Zhang Hong et al. International Journal of Refractory Metals and Hard Materials[J], 2013, 41: 563 [Baidu Scholar]
Wu Wangping, Chen Zhaofeng, Wang Liangbing. Protection of Metals and Physical Chemistry of Surfaces[J], 2015, 51(4): 607 [Baidu Scholar]
Chen Zhaofeng, Wu Wangping, Cong Xiangna et al. Advanced Manufacturing Technology[J], 2011, 314-316: 214 [Baidu Scholar]
Huang Yongle, Bai Shuxin, Zhang Hong et al. Surface & Coatings Technology[J], 2016, 288: 52 [Baidu Scholar]
Luo X, Yang Y Q, Liu Y C et al. Materials Science and Engineering A[J], 2007, 459(1-2): 244 [Baidu Scholar]
Das M, Balla V K, Basu D et al. Scripta Materialia[J], 2010, 63(4): 438 [Baidu Scholar]
Abdollahi A, Torabi S, Valefi Z et al. Corrosion Science[J], 2019, 159: 108 136 [Baidu Scholar]
Liu Chenxu, Zhang Shuguang, Ruonan Ji et al. Ceramics International[J], 2019, 45(4): 4747 [Baidu Scholar]
Bakhit B, Akbari A. Surface and Coatings Technology[J], 2014, 253: 76 [Baidu Scholar]
Cho S, Jo I, Y Lee H et al. Applied Surface Science[J], 2018, 448: 407 [Baidu Scholar]
Tanaka Y, Kagawa Y, Liu Y F et al. Materials Science and Engineering A[J], 2001, 314(1-2): 110 [Baidu Scholar]
Franco M, Sha W, Tan V et al. Materials & Design[J], 2015, 85: 248 [Baidu Scholar]
Mandal D, Viswanathan S. Materials Characterization[J], 2013, 85: 73 [Baidu Scholar]
Yang Y, Cheng Y F. Electrochimica Acta[J], 2013, 109: 638 [Baidu Scholar]
Finnis M W, Kruse C, Schönberger U. Nanostructured Materials[J], 1995, 6(1-4): 145 [Baidu Scholar]
Xiong Huihui, Liu Zhao, Zhang Henghua et al. Journal of Physics and Chemistry of Solids[J], 2017, 107: 162 [Baidu Scholar]
Jin Na, Yang Yanqing, Luo Xian et al. Applied Surface Science[J], 2014, 314: 896 [Baidu Scholar]
Li Jian, Yang Yanqing, Li Lili et al. Journal of Applied Physics[J], 2013, 113(2): 23 516 [Baidu Scholar]
Vanderbilt D. Physical Review B[J], 1990, 41(11): 7892 [Baidu Scholar]
Segall M D, Lindan P J D, Probert M J et al. Journal of Physics, Condensed Matter[J], 2002, 14(11): 2717 [Baidu Scholar]
White J A, Bird D M. Physical Review B[J], 1994, 50(7): 4954 [Baidu Scholar]
Kohn W, Sham L J. Physical Review[J], 1965, 140(4A): 1133 [Baidu Scholar]
Fischer T H, Almlof J. The Journal of Physical Chemistry[J], 1992, 96(2): 9768 [Baidu Scholar]
Karch K, Pavone P, Windl W et al. International Journal of Quantum Chemistry[J], 1995, 56(6): 801 [Baidu Scholar]
Madelung O, Rössler U, Schulz M. Silicon Carbide[M]. Heidelberg: Springer, 2001 [Baidu Scholar]
Gong H R, Liu Y, Tang H P et al. Applied Physics Letters[J], 2008, 92(21): 211 914 [Baidu Scholar]
Yamabe-Mitarai Y, Koizumi Y, Murakami H et al. Scripta Materialia[J], 1997, 36(4): 393 [Baidu Scholar]
Arbouche O, Belgoumène B, Soudini B et al. Computational Materials Science[J], 2010, 47(3): 685 [Baidu Scholar]
Reznik B, Gerthsen D, Zhang W G et al. Journal of the European Ceramic Society[J], 2003, 23(9): 1499 [Baidu Scholar]
Lee Y J, Choi D J, Park J Y et al. Journal of Materials Science[J], 2000, 35(18): 4519 [Baidu Scholar]
Bi Kai, Liu Jun, Dai Qixun. Applied Surface Science[J], 2012, 258(10): 4581 [Baidu Scholar]
Fiorentini V, Methfessel M. Journal of Physics, Condensed Matter[J], 1998, 10: 895 [Baidu Scholar]
Siegel D G, Hector Jr L G, Adams J B. Surface Science[J], 2002, 498(3): 321 [Baidu Scholar]
Pan Y, Lin Y H, Wang H et al. Computational Materials Science[J], 2016, 111: 74 [Baidu Scholar]