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TiC对CuW触头材料组织与性能的影响
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TG146.23 TG146.11

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国家自然科学基金资助项目(50474012)


Effects of TiC on Microstructures and Properties of CuW Electrical Contact Materials
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    摘要:

    采用粉末冶金-熔渗法制备了不同TiC添加量的CuW合金。研究了添加TiC对CuW材料静态性能、真空电击穿性能及显微组织的影响。结果表明:TiC的添加量在0~1.2%(质量分数,下同)时,随着添加量的增加,合金的硬度逐渐升高,而电导率变化不大;当添加量在1.2%~2.0%范围内时,硬度和电导率则大幅下降。添加TiC相提高了CuW材料的耐电压强度,降低了截流值。对真空电击穿后的表面组织形貌分析发现,由于TiC相在钨骨架上的钉扎作用,铜液的飞溅较小;电击穿发生在Cu/TiC相界面上,且击穿坑较小。

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    A series of Cu-W alloys added with TiC particles were prepared by means of powder metallurgy-infiltration process. The effects of TiC addition on the microstructure and properties were investigated for the Cu-W alloys, respectively, including the static property and the vacuum breakdown property. The results showed that the hardness of W-Cu alloys increased with increasing percentage of TiC, while the electric conductivity changed slightly for TiC addition in the range of 0wt %-1.2wt%, but dramatical decreases were observed for TiC addition from 1.2wt% to 2wt%. The dielectric strength was improved and the chopping current of was decreased by TiC phase addition. The metallographic analysis of Cu-W alloys after vacuum breakdown showed that the splash of liquid copper was decreased because the TiC phase nailed on the skeletons of tungsten. The vacuum breakdown took place in interphase boundaries of copper and TiC with smaller cathode craters.

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杨晓红 范志康 梁淑华 肖鹏. TiC对CuW触头材料组织与性能的影响[J].稀有金属材料与工程,2007,36(5):817~821.[Yang Xiaohong, Fan Zhikang, Liang Shuhua, Xiao Peng. Effects of TiC on Microstructures and Properties of CuW Electrical Contact Materials[J]. Rare Metal Materials and Engineering,2007,36(5):817~821.]
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  • 最后修改日期:2006-05-10
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