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直流电沉积Ni-W-P镀层研究
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Study on Direct-Current Electroplated Ni-W-P Layer
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    摘要:

    采用直流电沉积法,在低碳钢表面成功沉积Ni-W-P镀层。应用X射线荧光(XRF)、扫描电子显微镜(SEM)、俄歇电子能谱(AES)、X射线衍射(XRD)仪等方法,研究电流密度、镀液pH值和镀液温度对Ni-W-P镀层成分、表面形貌和结构的影响。结果表明,电流密度和镀液pH值的变化对Ni-W-P镀层成分的影响很大,而电流密度、镀液pH值和温度对镀层厚度的影响较小。电流效率随着电流密度和镀液温度的增大分别降低和升高,而随着镀液pH值的变化,在pH=7.0时有极大值。镀液pH值对Ni-W-P镀层结构有较大影响,在pH=8.0时,镀层呈现明显的Ni(111)峰,此时镀层硬度达到极大值7130 MPa。在此基础上,对Ni-W-P镀层的电沉积机制做了进一步探讨。

    Abstract:

    Ni-W-P layers were formed on a low-carbon steel substrate by direct-current electroplating method. The effects of current density, pH value and bath temperature on the composition, surface morphology, and microstructure of Ni-W-P layers were studied by X-ray fluorescence (XRF), scanning electron microscope (SEM), auger electron spectroscopy (AES) and X-ray diffraction (XRD). The results indicate that the change of current density and pH value influenced the composition of Ni-W-P layer greatly, but the change of current density, pH value and bath temperature hardly influenced the thickness of Ni-W-P layer. As current density and bath temperature increased, current efficiency decreased and increased, respectively, and current efficiency reached the maximum value when pH value is 7.0. The structure of Ni-W-P layer was greatly influenced by pH value, and a well-preferred orientation along Ni (111) direction was shown when pH value was 8.0. Synchronously, the microhardness of Ni-W-P layer reached the maximum value of 7130 MPa. At last, electroplating mechanism of Ni-W-P layer was discussed further.

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刘殿龙,杨志刚,刘 璐,张 弛.直流电沉积Ni-W-P镀层研究[J].稀有金属材料与工程,2010,39(1):60~64.[Liu Dianlong, Yang Zhigang, Liu Lu, Zhang Chi. Study on Direct-Current Electroplated Ni-W-P Layer[J]. Rare Metal Materials and Engineering,2010,39(1):60~64.]
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  • 收稿日期:2009-06-15
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