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Diffusion, Intrusion and Reaction between Al-Containing In-termetallics and TiC Sintered Body during Thermal Pressure Holding
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Diffusion, Intrusion and Reaction between Al-Containing In-termetallics and TiC Sintered Body during Thermal Pressure Holding
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    摘要:

    分别以Fe40Al、Ni3Al和TiAl(NbCr) 金属间化合物为基体,在一定的压力和温度下,使其和低孔隙率TiC粉体烧结体有效结合。采用扫描电镜及能谱仪等对其界面的组织结构进行分析。结果表明,所有金属间化合物均与TiC烧结体形成了冶金结合的界面。TiC烧结体在高温保压过程中有微量分解,扩散进入了Fe40Al和Ni3Al基体表层,降低了其熔点,从而使其成为可流动状态,被挤压进入TiC烧结体的孔隙。但TiAl(NbCr) 合金未能进入TiC烧结体孔隙,而是在与TiC的界面处形成了一层Ti含量高于基体约10 at%的反应层。

    Abstract:

    Intermetallics of Fe40Al, Ni3Al and TiAl(NbCr) were used as matrix to effectively bond a layer of TiC sintered body with low porosity. The coupled intermetallic and the TiC sintered body were held at high temperatures and a given pressure. The microstructure of the interface was observed and analyzed by scanning electron microscopy (SEM) and energy dispersive spectra (EDS). The results show that the bond between the intermetallics and the TiC sintered body is a metallurgical bond. TiC slightly decomposes and diffuses into the surface layers of Fe40Al and Ni3Al during the holding time, resulting in decrease of their melting points, and hence the intermetallic is in a flowing state and intruded into the pores of the TiC sintered body at the interface. However, the TiAl(NbCr) alloy can not be intruded into the pores of TiC sintered body; instead, a distinct reaction layer with more than 10 at% Ti (higher compared with the matrix) is formed at the interface of the TiAl(NbCr) alloy and the TiC sintered body.

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巫红燕,高明霞,Oliveira Filipe J.,朱 丹,潘 颐,Vieira Joaquim M. Diffusion, Intrusion and Reaction between Al-Containing In-termetallics and TiC Sintered Body during Thermal Pressure Holding[J].稀有金属材料与工程,2012,41(2):203~207.[Wu Hongyan, Gao Mingxia, Oliveira Filipe J.,Zhu Dan, Pan Yi, Vieira Joaquim M. Diffusion, Intrusion and Reaction between Al-Containing In-termetallics and TiC Sintered Body during Thermal Pressure Holding[J]. Rare Metal Materials and Engineering,2012,41(2):203~207.]
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  • 收稿日期:2011-03-25
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