+高级检索
电流密度对超临界CO2流体镍电铸层表面性能和过程参数的影响
DOI:
作者:
作者单位:

作者简介:

通讯作者:

中图分类号:

基金项目:

国家自然科学基金(50875116);常州市工业科技攻关计划(CE20100045)


Effect of Current Density on Surface Properties and Process Parameters of Nickel Film Electroformed under Supercritical CO2 Fluids
Author:
Affiliation:

Fund Project:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
  • |
  • 文章评论
    摘要:

    采用非离子表面活性剂,进行超临界CO2流体(SCF-CO2)电铸金属镍的研究,分析电流密度对CO2超临界流体镍电铸层微观组织、显微硬度、阴极电流效率、沉积速率、铸层厚度的影响。结果表明,随着阴极表面电流密度从3 A/dm2逐渐增加至9 A/dm2,体系电流效率快速下降,金属镍电铸层的显微硬度、沉积速率、铸层厚度不断增大。在压力为10 MPa,温度为323 K,电流密度为5 A/dm2时,镍电铸层的显微硬度、铸层厚度、阴极电流效率、沉积速率分别为7.01 GPa、30.5 μm、94.51%、51.85 mg/cm2·h,与传统电铸方法相比较,SCF-CO2电铸法制备的镍电铸层表面平整、微观组织致密。

    Abstract:

    The experiment of nickel electroforming with non-ionic surfactant was carried out under supercritical CO2 fluid. The effects of current density on microstructure, Vickers hardness, current efficiency, depositing rate and thickness were discussed. The results indicate that the microhardness, the depositing rate, the thickness of the nickel films gradually increase while the current efficiency decreases with the current density growing from 3 A/dm2 to 9 A/dm2. In the cases of 10 MPa, 323 K and 5 A/dm2, the microhardness, the current efficiency, the depositing rate and the thickness of nickel films are 7.01 GPa, 94.51%, 51.85 mg/cm2·h and 30.5 μm, respectively. Compared to the conventional electroforming method, the nickel film by SCF-CO2 electroforming has more flat surface and more dense microstructure.

    参考文献
    相似文献
    引证文献
引用本文

李权才,王星星,雷卫宁,刘维桥,姜 博.电流密度对超临界CO2流体镍电铸层表面性能和过程参数的影响[J].稀有金属材料与工程,2012,41(7):1279~1283.[Li Quancai, Wang Xingxing, Lei Weining, Liu Weiqiao, Jiang Bo. Effect of Current Density on Surface Properties and Process Parameters of Nickel Film Electroformed under Supercritical CO2 Fluids[J]. Rare Metal Materials and Engineering,2012,41(7):1279~1283.]
DOI:[doi]

复制
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
  • 引用次数:
历史
  • 收稿日期:2011-08-04
  • 最后修改日期:
  • 录用日期:
  • 在线发布日期:
  • 出版日期: