In this paper, the influence of different substrate temperatures of Ti film prepared by the direct current (DC) magnetron sputtering on the internal residual stress of Ti film was investigated experimentally by nanoindentation technique using Suresh model and Lee model. The comparison between the results of nanoindentation method and curvature method was performed. At the same time, the surface morphology and microstructure of Ti film are analyzed using atomic force microscope (AFM) and X-ray diffraction (XRD). The results showed that the residual stress value obtained using Suresh model was almost the same as that by the curvature method, so the Suresh model is more suitable for calculating the residual stress of Ti film. Together with the nanoindentation data and micro-structure analysis, it was found that with the substrate temperature rising, the grain size of Ti film first increased and then decreased; the residual stress of the Ti film changed from the compressive stress to tensile stress.