+高级检索
工艺参数对钨丝表面无氰镀金质量的影响
DOI:
作者:
作者单位:

作者简介:

通讯作者:

中图分类号:

基金项目:


Effects of Technological Parameters on the Quality of Electrodeposited Gold Film on Tungsten Helix
Author:
Affiliation:

Fund Project:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
  • |
  • 文章评论
    摘要:

    为了实现钨螺旋线表面镀金薄膜质量可控,研究了无氰电镀过程中工艺参数如电流密度、镀液温度和沉积时间对镀金层质量的影响规律。利用扫描电子显微镜对镀金层形貌进行观察分析。结果表明:电流密度影响镀金薄膜的表面平整度及晶粒大小;镀液温度影响无氰镀液稳定性,从而影响薄膜的表面光泽度及平整度;电沉积时间对镀层覆盖效果影响较大。沉积时间过短,镀层覆盖效果差;时间过长,边角效应严重。沉积时间宜控制在1.5 h内

    Abstract:

    To control the surface quality of gold films electrodeposited on tungsten helix, the effects of current density, electrolytic temperature and deposition time on the electrodeposits were studied. The morphology of gold films was evaluated by means of scanning electron microscope (SEM). The results indicate that current density affects the grain size of the film. When electrodepositing at higher current density, the surface defects such as burring and sponge feature the gold film. The electrolytic temperature causes poorer stability of electrolytic solution and deposition quality. In addition, the variation of deposition time results in different electrodeposits quality. With increasing the deposition time, the edge effect is serious. The proper deposition time is about 1.5 h

    参考文献
    相似文献
    引证文献
引用本文

范爱玲,丁艳凤,张 姗,马 捷,魏建忠.工艺参数对钨丝表面无氰镀金质量的影响[J].稀有金属材料与工程,2014,43(11):2847~2850.[Fan Ailing, Ding Yanfeng, Zhang Shan, Ma Jie, Wei Jianzhong. Effects of Technological Parameters on the Quality of Electrodeposited Gold Film on Tungsten Helix[J]. Rare Metal Materials and Engineering,2014,43(11):2847~2850.]
DOI:[doi]

复制
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
  • 引用次数:
历史
  • 收稿日期:2013-11-18
  • 最后修改日期:
  • 录用日期:
  • 在线发布日期: 2015-04-07
  • 出版日期: