An environment-friendly surface etching and activation technics for ABS surface metallization were investigated as a replacement for conventional chromic acid etching bath and palladium catalyst. After etching by H₂SO₄-MnO₂ colloid, the ABS surfaces become roughness; meanwhile the carboxyl and hydroxyl groups were formed on the surface. With absorption and a reduction by a sodium borohydride solution, copper particles were deposited on the ABS surface, which serves as a catalyst replacement for SnCl₂/PdCl₂ colloid. The effects of CuSO₄ concentration, NaBH₄ concentration, reduction temperature and reduction time on the adhesion strength between the ABS surface and the electroless copper film were investigated. The average adhesion strengths reached 0.87 KN m_-1.