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钨粉级配法制备新型铜钨合金
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西安理工大学,西安理工大学,西安理工大学,西安理工大学,西安理工大学

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“ 863”计划(2015AA034304),国家自然科学基金(No.51401162)(No.U1502274),陕西省科技计划 (2014SZS08-Z01) (2015XT-16)资助.


Preparation of New Copper-tungsten Alloy by Grading Tungsten Powder
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    摘要:

    传统单一粒径钨粉制备的铜钨(CuW)合金难以满足电容器开关中高频次开断电触头的使用要求,本文采用三种粒径钨粉(超微米、微米和亚微米)级配法制备了新型CuW合金,利用场发射扫描电镜对CuW合金组织特征进行显微分析,并对新型CuW合金耐电弧击穿性能进行研究。结果表明,钨粉级配制备CuW合金,能形成多种W-W烧结颈,强化钨骨架,熔渗Cu相更分散更均匀,从而使得CuW合金硬度、电导率度均高出国家标准30~40%,且CuW合金耐电压强度较高,此外,新型 CuW/CrCu整体材料结合强度高出国家标准40~60%。

    Abstract:

    The traditional CuW alloy prepared by single particle size of tungsten powder has been difficult to meet the requirement of electrical contact of the high-frequency switching capacitor switch.This experimen prepares CuW alloy with three kinds of particle size of tungsten powder (super rice, micron and submicron).The microstructures of CuW alloy were analyzed by field emission scanning electron microscopy and the arc breakdown properties of CuW alloys were investigated.The results show that CuW alloy prepared by grading tungsten powder can form a variety of W-W sintered neck which strengthened tungsten skeleton. This kind of tungsten skeleton makes the Cu phase more uniform and more dispersed.The hardness and electrical conductivity of the CuW alloy is 30~40% higher than the national standard, and the CuW alloy has a higher resistance of voltage strength.In addition,the bonding strength of the CuW/CrCu prepared by grading tungsten powder is 40~60% higher than the national standard.

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邹军涛,王媛媛,杨晓红,肖鹏,梁淑华.钨粉级配法制备新型铜钨合金[J].稀有金属材料与工程,2017,46(9):2661~2666.[Zou Juntao, Wang Yuanyuan, Yang Xiaohong, Xiao Peng, Liang Shuhua. Preparation of New Copper-tungsten Alloy by Grading Tungsten Powder[J]. Rare Metal Materials and Engineering,2017,46(9):2661~2666.]
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  • 收稿日期:2016-10-21
  • 最后修改日期:2017-03-16
  • 录用日期:2017-03-16
  • 在线发布日期: 2017-11-29
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