赵玉超,唐建成,叶楠,卓海鸥,韦朝龙,周威威.电镀制备WC@W-Cu复合材料与性能研究[J].稀有金属材料与工程,2021,50(4):1384~1390.[Zhao Yuchao,Tang Jiancheng,Ye Nan,Zhuo Haiou,Wei Chaolong,Zhou Weiwei.Study on the properties of WC@W-Cu composite prepared by electroplating[J].Rare Metal Materials and Engineering,2021,50(4):1384~1390.]
电镀制备WC@W-Cu复合材料与性能研究
投稿时间:2020-08-28  修订日期:2020-11-02
中文关键词:  W-Cu复合材料  WC@W-Cu复合材料  复合电镀  微观结构  电导率
基金项目:国家自然科学基金项目(面上项目,重点项目,重大项目)
中文摘要:
      W-Cu复合材料因具有低膨胀系数、高强度及导电导热性能而广泛用作电子封装、电极、电触头和炮弹的罩壳等材料。W-Cu复合材料传统制备方法在致密化、微观组织的均匀性等方面难以兼顾,导致材料的导电导热性能不足,难以满足现代电子工业的要求。以W粉及W粉表面碳化得到的WC@W粉为原料,采用复合电镀技术成功制备了W-Cu和WC@W-Cu复合材料。结果表明,W-Cu复合材料表面粗糙,微观组织存在孔洞,而WC@W-Cu复合材料晶粒细化,微观结构组织均匀、致密。WC@W-Cu复合材料的W含量为43.6wt.%,硬度达205HV,相对密度为99.3%,电导率可达54.6MS/m。采用WC@W纳米粉,电镀制备出的WC@W-Cu复合材料不仅增加了W含量,明显提高了硬度,而且在相对密度和导电性方面也优于W-Cu复合材料。
Study on the properties of WC@W-Cu composite prepared by electroplating
英文关键词:W-Cu composite  WC@W-Cu composite  composite electroplating  microstructure  electrical conductivity
英文摘要:
      W-Cu composite are widely used as materials for electronic packaging, electrodes, electrical contacts, and shells of artillery shells because of its low expansion coefficient, high strength, high electrical and thermal conductivity. The traditional preparation methods of W-Cu composite are difficult to take into account the densification and the uniformity of the microstructure, resulting in insufficient electrical and thermal conductivity of the material, and it is difficult to meet the requirements of the modern electronics industry. Using W powder and WC@W powder obtained by carbonization of the surface of W powder as raw materials, W-Cu and WC@W-Cu composites were successfully prepared by composite electroplating technology. The results show that the surface of W-Cu composite is rough and there are holes in the microstructure, while the WC@W-Cu composite has refined grains, and the microstructure is uniform and dense. The W content of WC@W-Cu composite is 43.6wt.%, the hardness is 205HV, the relative density is 99.3%, and the electrical conductivity can reach 54.6MS/m. The WC@W-Cu composite not only increases the W content and significantly improves the hardness, but also is better than the W-Cu composite in relative density and conductivity.
作者单位E-mail
赵玉超 南昌大学材料科学与工程学院 zyqzhaoyuchao@163.com 
唐建成 南昌大学材料科学与工程学院 tangjiancheng@ncu.edu.cn 
叶楠 南昌大学材料科学与工程学院  
卓海鸥 南昌大学材料科学与工程学院  
韦朝龙 南昌大学材料科学与工程学院  
周威威 南昌大学材料科学与工程学院  
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