Ling Yunhan1,Bai Xinde1,Li Jiangtao2,Ge Changchun2
TB331 TB34
[Ling Yunhan, Bai Xinde, Li Jiangtao, Ge Changchun. Optimum Design of W/Cu Functionally Graded Material for Thermal Stress Mitigation[J]. Rare Metal Materials and Engineering,2003,(12):976~980.]
DOI：[doi]