Abstract
Aiming at solving the problem of poor strength, low conductivity and thermal conductivity of Cu-W alloys, high pressure aging treatment was conducted to reinforce Cu-51.15W-0.24Cr alloy. The microstructure, hardness, thermal conductivity and conductivity of the alloy after high pressure aging treatment and normal pressure aging treatment were compared. The results show that high pressure aging treatment can increase the compactness of Cu48.61W51.15Cr0.24 alloy, eventually resulting in more dispersed distribution and finer grain size of Cr phase during the aging treatment, and improving the hardness and thermal conductivity of the alloy. After solution treatment at 960 °C for 1 h and aging at 500 °C for 1 h under a pressure of 3 GPa, the hardness, thermal diffusivity and resistivity are determined to be 1540 MPa, 0.5236 c
Science Press
Cu-W alloys have been widely used as vacuum switch contact materials and resistance welding electrodes owing to their high voltage withstanding stress, good electrical conductivity and resistance to surface weldin
Compared to the above methods, high pressure heat treatment is an effective technique to improve the properties of materials. Because high pressure can reinforce the densification of the material, it has a significant effect on the element diffusion and microstructure transformation during the solid phase transformatio
For this reason, the aim of the current study is to investigate the influence of high-pressure aging treatment on microstructure and properties of Cu-51.15W-0.24Cr alloy. The hardness, resistivity and thermal diffusivity were tested by microhardness tester, resistivity tester and thermal constant tester, respectively. The results can provide reference data for understanding the influence of high pressure treatment on the structure and properties of Cu-51.15W-0.24Cr alloy.
The ingot with the composition of Cu-51.15W-0.24Cr (wt%) was prepared by the infiltration method. The ingot samples were put into a KLX-12B box-type resistance furnace and solution-treated at 960 °C for 1 h, and then cooled by water to room temperature. After that, some samples were aged under high pressure. The high pressure aging was performed in CS-IB type six-anvil high-pressure equipment (

Fig.1 High pressure assembly diagrams: (a) sample assembly diagram and (b) schematic diagram of sample pressure
The microstructure analysis was carried out on Axiovert200MAT optical microscopy (OM), S-3400N scanning electron microscopy (SEM) and Jeol-2010 transmission electron microscope (TEM). The optical microscope specimens were polished and etched using 3% FeCl3+10% HCl solution. The FM-ARS-9000 microhardness tester (with a load of 50 g for a dwell time of 20 s) and the THV-5 Vickers hardness tester (with a load of 500 g for a dwell time of 20 s) were used to determine the hardness of the constituent phase and the overall hardness of the sample. The samples were shaped into the dimensions of Φ4 mm×10 mm, and then the resistivity was tested on a ZEM-3 resistivity tester. The samples before and after high pressure treatment were shaped into the dimensions of Φ8 mm×1.5 mm, and then the thermal diffusion coefficient was measured by a TC-7000 thermal constant tester. During the experiment, each data was measured at least three times to ensure the reliability.

Fig.2 Microstructures of Cu-51.15W-0.24Cr under different states: (a) as-cast, (b) normal-pressure aging treatment at 500 °C for 1 h, and
(c) high-pressure aging treatment at 500 °C for 1 h

Fig.3 SEM back scattering morphologies of Cu-51.15W-0.24Cr alloy after normal-pressure aging treatment at 500 °C for 1 h (a) and high-pressure aging treatment at 500 °C for 1 h (b)

Fig.4 SEM morphologies of fracture of Cu-51.15W-0.24Cr alloy after normal-pressure aging treatment at 500 °C for 1 h (a) and high-pressure aging treatment at 500 °C for 1 h (b)
Through TEM observation (

Fig.5 TEM images of precipitates in Cu-51.15W-0.24Cr alloy after normal-pressure aging treatment at 500 °C for 1 h (a) and high-pressure aging treatment at 500 °C for 1 h (b)

Fig.6 presents the variation of hardness as a function of aging temperature and holding time. It evidences that the investigated samples with high-pressure aging treatment have higher hardness than that with normal pressure aging. Fig.6a shows that the hardness values in both cases increase rapidly with the rise of aging temperature and approach the highest peak hardness at 500 °C, and then decrease. Fig.6b shows the change of hardness with aging time. It can be seen that the hardness increases at the beginning of aging treatment and then decreases with the extending of aging time, and reaches the peak value after aging treatment for 1 h. Further, the maximum of hardness value of the sample aged at 500 °C for 1 h under high pressure reaches 1540 MPa, which is improved by 26.23% and 17.56% as compared with that of the specimens with solution treatment and normal pressure aging treatment, respectively.
As listed in
According to
At the same time, high pressure can lead to lattice deformation and increase the number of dislocations. High dislocation density provides more effective sites for the precipitation of Cr particles, resulting in increase of the Cr precipitation. In addition, high pressure can suppress the diffusion of atoms, making growth of Cr particles difficult, thereby causing a large number of small size and homogenous spatial distribution particles to precipitate during high-pressure aging (
(1) |
where τ is the shear stress, G is the shear modulus, b is Burger vector and r stands for the spacing for the intra crystalline particles. The smaller the size of precipitates, the smaller the spacing between precipitates, the greater the stress for dislocations to shear through the precipitates. In addition, dislocation interacts with the precipitate to exert a strong pinning effect. Therefore, obvious precipitation strengthening is obtained during high pressure aging treatment. This explains the reason why the hardness of samples after high pressure aging treatment is higher than that obtained by the normal pressure aging treatment.
It is worth noting that hardness begins to show a decline trend when the aging temperature exceeds 500 °C or holding time is longer than 1 h, and the precipitates begin to grow up and destroy the coherent relationship with the matrix, which leads to the drop of hardness. The results show that the hardness of high pressure aged samples decreases slowly compared to that of atmospheric pressure aged samples, which can be due to the fact that the precipitated Cr particles are not easy to grow under high pressure. This may be related to the suppression of element diffusion by high pressure, which has been verifie

Fig.7 shows the variation of resistivity as a function of aging temperature and holding time. It can be seen that electrical resistivity of the alloy with high pressure aging treatment is lower than that of atmospheric aging-treated samples. As shown in Fig.7a, the resistivity of the sample decreases with the rise of temperature and then remains stable, and reaches the minimum value at 500 °C. Fig.7b shows that the resistivity decreases with increasing the aging time at 500 °C for both samples. Further, the resistivity decreases slightly when the aging time is more than 1 h. The sample aged at 500 °C for 1 h under high pressure has the lowest resistivity, with the value of 4.458×1

Fig.8 shows the thermal diffusivity of the investigated alloy as a function of aging temperature and holding time. Obviously, the thermal diffusivity of the alloy aged under high pressure is higher than that of the specimens aged under the normal pressure condition. The change trend of thermal diffusivity shows an opposite trend to that of the hardness curve. The thermal diffusivity rises with the increase of aging temperature, then declines slightly and reaches the peak value at 500 °C. As shown in Fig.8b, when the aging time exceeds 1 h at 500 °C, the diffusivity changes slightly and tends to be stable. According to the experimental data, the sample aged at 500 °C for 1 h under high pressure has the highest thermal diffusivity, with the value of 0.5236 c
The relationship between conductivity and thermal diffusivity is as follows:
(2) |
where λ is the thermal diffusivity of the alloy, ρ is resistivity, L′ is the modified Lorentz constant, T is the thermodynamic temperature. There is a negative correlation between resistivity and thermal diffusivity. It is widely accepted that the resistivity and thermal diffusivity of alloys depend on the solute atoms in the matrix. It is well known that the heat conduction and electric conduction are affected by the movement of electrons. It can be easily obtained that the more the solute atoms contained in the solid solution, the stronger the scattering effect on the electrons, the larger the resistivity of the alloy, and the lower the thermal diffusivity. After the solution treatment, due to the large amount of Cr atoms in the Cu matrix, a larger resistivity and a smaller thermal diffusivity of Cu-51.15W-0.24Cr alloy are obtained. After aging treatment, more and more Cr atoms precipitate from the Cu matrix with the increase of aging temperature in early aging stage, eventually resulting in the decline of resistivity and the rise of thermal diffusivity. However, as the aging temperature exceeds 500 °C, some of the Cr precipitates are dissolved in the matrix and eventually result in the uptrend of resistivity and downtrend of thermal diffusivity.
As the holding time is longer than 1 h at 500 °C, the quantity of Cr particles remains basically unchanged, leading to a tendency to maintain stable resistivity and thermal diffusivity. According to SEM images of alloys, the high-pressure aging treatment can reduce the number of micropores in the alloy, thereby reducing the scattering of electrons which is closely related to the micropores. This is also one of the reasons why the thermal diffusivity of the investigated alloy under high pressure aging treatment is higher than that of atmospheric aging treated alloy, and why the resistivity is lower than that of normal pressure aging treated alloy.
1) High-pressure aging treatment can improve the mechanical properties and optimize the microstructure of Cu-51.15W-0.24Cr alloy.
2) The Cu-51.15W-0.24Cr alloy, with a hardness of 1540 MPa, thermal diffusivity of 0.5236 c
3) The improvement of hardness is mainly ascribed to the high pressure, which can increase the compactness of alloy and improve the compressive deformation ability. Addi-tionally, high pressure increases the number of dislocations and makes the Cr particles more dispersed and finer, even-tually resulting in a stronger precipitation strengthening effect.
4) After the high pressure aging treatment, the electrical and thermal conductivity can be improved. It indicates that the sca-ttering effect of microstructure on electrons is weakened, which is mainly due to the reduction of micropores in Cu ma-trix and the improvement of the dispersibility of Cr precipitation.
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