Microstructure and grain boundary character during hot deformation globularization processes of TC11 alloy with annealed-lamellar structure were investigated by TEM, SEM and EBSD techniques. The results indicate that globularization processes include: 1) forming of sub-structures with low-angle boundaries by deformation and recovery in α plates; 2) disintegrating of α plates by diffusion and slipping along grain boundaries; 3) globularizing of α grains and homogenizing of structure by diffusing and slipping along grain boundaries. EBSD testing results indicate that globularization mechanisms during hot deformation processes of the alloy with lamellar structure are continuous dynamic recrystallization occurring in α plates and dynamic recovery or discontinuous dynamic recrystallization occurring in β phase