Au-19.25Ag-12.80Ge solder ribbons were prepared by single-roller melt spinning technology. The melting behavior and microstructure of the solder ribbons were analyzed by means of differential thermal analyzers, SEM and TEM, and the welding property with Ni was also studied. The results show that liquidus temperature of the solder ribbons prepared by the single-roller melt spinning method is some lower than that of the mother alloy, and the melting temperature interval is decreased by 4 oC. Uniformly distributed and greatly refined microstructure has been obtained because of the melt spinning process, and nanocrystalline with a size of 40-50 nm has formed close to the roller surface side; there exists a structure mutation in the direction of ribbon thickness, and the mutation is possibly caused by the critical cooling rate. The solder ribbon has good wettability with Ni and reliable metallurgical bonding interface has formed. Under the same condition, the shear strength of the welding joint with Ni has increased by 60% compared with that of the welding joint of the mother alloy solder.