Mo particle reinforced copper composites with Mo 2.5-10.8 vol% were prepared by Electron beam physical vapor deposition (EB-PVD), the microstructure, hardness and electrical resistivity were investigated. The results show that the Cu matrix is composed of columnar crystalline and the average grain size of Mo particle is 2.4-8.1nm; the columnar crystal width of copper matrix, hardness and electrical resistivity of the composites increase with the increase of the Mo content; the strengthening mechanism of the composites by EB-PVD is mainly the Orowan mechanism.